Apple plans iPhone 18 A20 chip WMCM packaging

A report says the iPhone 18 will use a 2nm A20 chip with WMCM packaging, aiming to boost performance and AI tasks.

Apple plans iPhone 18 A20 chip WMCM packaging

Apple is set to unveil the iPhone 17 lineup soon, but a new report argues the next year’s iPhone 18 could arrive with a notable hardware push. The A20 chip is said to be built on a 2nm process and will use a Wafer-level Multi-Chip Module packaging, moving away from InFO.

The WMCM approach connects the processor and memory at wafer level, reducing steps and potentially improving heat and signal integrity. If true, the A20 could deliver faster speeds and better efficiency, especially for on-device AI tasks and gaming. Siri is also rumored to receive a stronger upgrade next spring, aligning software improvements with the new hardware.

If Apple adopts WMCM, it signals a broader shift in how iPhone silicon is designed, not just the chip but the surrounding packaging. The change could lower manufacturing steps and improve yields, but it may also affect costs and supplier dynamics. The focus on AI workloads shows a push to future proof devices for on-device inference and smarter real-time processing.

The move to a 2nm process adds another layer of risk and opportunity. While it promises performance gains, it also brings potential yield and cost challenges that could ripple through pricing and supply chains. If successful, the strategy could push competitors to accelerate their own packaging and memory integration efforts.

Highlights

The real test is whether these advances make a noticeable difference in daily use.